66AK2G12ABYA60ES

66AK2G12ABYA60ES

  • Description:PROTOTYPE
  • Series:66AK2G1x KeyStone II Multicore

SKU:bf5147342334 Category: Brand:

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Product Detailed Parameters

  • Description:PROTOTYPE
  • Series:66AK2G1x KeyStone II Multicore
  • Mfr:Texas Instruments
  • Package:Bulk
  • Type:DSP+ARM®
  • Interface:CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
  • Clock Rate:600MHz
  • Non-Volatile Memory:External
  • On-Chip RAM:1MB
  • Voltage - I/O:1.8V, 3.3V
  • Voltage - Core:0.9V
  • Operating Temperature:-40°C ~ 105°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:625-LFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)
  • Grade:-
  • Qualification:-

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66AK2G12ABYA60ES

Overview

The Texas Instruments 66AK2G12 is a multicore System-on-Chip based on the Keystone II architecture, integrating an Arm Cortex-A15 subsystem and a C66x VLIW DSP core, both operating at up to 1000 MHz. It features 512KB of L2 memory in the Arm subsystem and 1MB of configurable L2 RAM with ECC in the DSP subsystem. The device includes two PRU-ICSS industrial subsystems, a Gigabit Ethernet MAC with IEEE 1588v2 support, and a comprehensive peripheral set including PCIe 2.0, dual USB 2.0 ports, and multiple audio interfaces. It supports DDR3L memory via a 36-bit EMIF and offers extensive error correction for reliability in industrial environments.

Feature Summary

  • Heterogeneous multicore architecture with Arm Cortex-A15 (up to 1000 MHz) and C66x DSP (up to 1000 MHz)
  • Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS) with enhanced GPIO and industrial protocols
  • Integrated Network Subsystem featuring Gigabit Ethernet MAC, NAVSS, and Crypto Engine with hardware acceleration
  • Extensive memory protection with ECC for L1/L2 processor memories, MSMC SRAM, and external DDR3L interface

Applications

  • Industrial Communications and Controls
  • Home Audio Systems
  • Professional Audio Equipment
  • Protection Relays
  • Industrial Transport

Procurement Notes

Verify the specific speed grade suffix (e.g., 'A60') against the official TI ordering information to ensure compliance with required operating frequencies. Confirm the package type is FCBGA (625) with dimensions 21.0 mm × 21.0 mm. Check the revision history for any updates to boot configuration or pin attributes that may affect board design compatibility.

Selection Notes

Select this SoC for applications requiring simultaneous real-time control via PRUs and high-performance processing via Arm/DSP cores. Ensure the design accommodates the 36-bit DDR3L interface supporting up to 1066 MT/s. Verify thermal management capabilities for the intended operating temperature range, as the device supports Industrial Extended (-40°C to 125°C) and Commercial (0°C to 90°C) grades.

Part Context

The 66AK2G12 belongs to the 66AK2G1x family of heterogeneous multicore SoCs. It shares the Keystone II architecture with other devices in the series but is distinguished by its specific core count, memory sizes, and peripheral integration. It is designed to replace legacy single-core processors in complex industrial and audio applications requiring higher throughput and deterministic real-time performance.

Replacement Considerations

Consult the Device Comparison section in the datasheet for related products within the 66AK2x Multicore DSP + Arm Processors family. Verify pin-to-pin compatibility and software driver support when considering alternative models with different core counts or peripheral sets.

66AK2G12ABYA60ES66AK2G12ABYA60ES

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