66AK2H06BAAW24

66AK2H06BAAW24

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:055992f9835f Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz DSP, 1.4GHz ARM®
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06BAAW24

Overview

The Texas Instruments 66AK2H06BAAW24 is a KeyStone II System-on-Chip featuring four TMS320C66x DSP cores and two ARM Cortex-A15 processors. The C66x cores operate at up to 1.2 GHz, delivering 38.4 GMACs/core for fixed-point and 19.2 GFlops/core for floating-point processing. The ARM cores run at up to 1.4 GHz with 4 MB of shared L2 cache. The device includes 6 MB of MSMC SRAM, a Network Coprocessor with security accelerators, USB 3.0, PCIe Gen2, and four SGMII ports. It utilizes a 1517-pin FCBGA package and supports extended operating temperatures from -40°C to 100°C.

Feature Summary

  • Six-core architecture combining four C66x DSPs (up to 1.2 GHz) and two ARM Cortex-A15 cores (up to 1.4 GHz).
  • Integrated Network Coprocessor supporting packet acceleration and hardware security engines for IPSec and SSL/TLS.
  • Includes USB 3.0 controller, PCIe Gen2, HyperLink, and four Gigabit Ethernet switch ports.
  • Features 6 MB of shared MSMC SRAM and dual 72-bit DDR3/DDR3L memory interfaces.

Applications

  • Embedded infrastructure applications such as cloud computing and high-performance computing.
  • Media processing, transcoding, and virtual desktop infrastructure.
  • Security appliances requiring hardware encryption and packet processing.
  • Analytics and gaming platforms utilizing multicore parallel processing.

Procurement Notes

Verify the specific suffix 'BAAW24' against official documentation to confirm manufacturing lot, temperature grade, or packaging variations. Ensure compatibility with existing board designs regarding the 1517-pin BGA footprint and power supply requirements. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly.

Selection Notes

Select this model when four DSP cores are sufficient for the workload, offering a cost-effective alternative to the eight-core 66AK2H14 or 66AK2H12 variants. Verify that the required peripheral count, specifically the number of available timers and serial interfaces, meets system constraints. Ensure software development kits support the specific core configuration and memory map.

Part Context

This component belongs to the 66AK2Hxx family of KeyStone II SoCs, which also includes the 66AK2H14 and 66AK2H12 models. These devices share the same architectural foundation but differ in core counts and peripheral availability. The 66AK2H06 variant provides a balanced performance tier optimized for applications requiring significant DSP throughput without the full capacity of the higher-end models.

Replacement Considerations

Direct replacements within the same package include the 66AK2H12AAW24 and 66AK2H14AAW24, provided the application can utilize the additional cores. Cross-model migration requires verification of pin compatibility and software adaptation for the different core configurations.

66AK2H06BAAW2466AK2H06BAAW24

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