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The Texas Instruments 66AK2H06BAAWA2 is a Multicore DSP+ARM KeyStone II System-on-Chip (SoC) designed for embedded infrastructure applications. It integrates four TMS320C66x DSP cores and two ARM Cortex-A15 MPCore processors within a 1517-pin FCBGA package. The device supports C66x frequencies up to 1.2 GHz and ARM frequencies up to 1.4 GHz. It features 6 MB of shared MSMC SRAM, a Network Coprocessor with Security Accelerator, and peripherals including USB 3.0, PCIe Gen2, and a five-port Ethernet switch. Operating temperatures range from -40°C to 100°C.
Verify the specific ordering suffix 'BAAWA2' against the manufacturer's current datasheet to confirm pinout compatibility and feature set. Ensure that the required operating temperature range (-40°C to 100°C) matches the system design constraints. Confirm availability status as this component may be subject to production lifecycle changes.
Select the 66AK2H06 variant when the application requires four DSP cores and two ARM cores rather than the eight-DSP configurations found in the 66AK2H12 or 66AK2H14 models. This selection optimizes power consumption while maintaining high-performance packet processing capabilities through the integrated network coprocessor.
This component belongs to the 66AK2Hxx family of KeyStone II SoCs manufactured by Texas Instruments. It shares the same physical package dimensions (40.0 mm x 40.0 mm) and core architecture as the 66AK2H12 and 66AK2H14, differing primarily in the number of active processor cores and specific peripheral implementations.
Direct replacements within the same package include the 66AK2H12 and 66AK2H14 models, which offer higher core counts but maintain software compatibility. Verify that the target board design accommodates the identical 1517-pin FCBGA footprint.