66AK2H06BAAWA24

66AK2H06BAAWA24

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:05d0234e999d Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz DSP, 1.4GHz ARM®
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06BAAWA24

Overview

The Texas Instruments 66AK2H06BAAWA24 is a KeyStone II System-on-Chip featuring four TMS320C66x DSP cores and two ARM Cortex-A15 processors. The C66x cores operate at up to 1.2 GHz, delivering 38.4 GMACs/core for fixed-point and 19.2 GFLOPS/core for floating-point processing. Each core includes 32 KB L1P, 32 KB L1D, and 1 MB local L2 cache. The ARM cluster runs at up to 1.4 GHz with 4 MB shared L2 cache. The device integrates 6 MB MSMC SRAM, a Network Coprocessor with Packet and Security Accelerators, and peripherals including USB 3.0, PCIe Gen2, SRIO, and a five-port Ethernet switch.

Feature Summary

  • Four C66x DSP cores (up to 1.2 GHz) and two ARM Cortex-A15 cores (up to 1.4 GHz)
  • Network Coprocessor supporting IPsec, GTP-U, SCTP, PDCP, and SSL/TLS
  • Six megabytes of shared MSMC SRAM with Memory Protection Unit
  • Peripherals include USB 3.0, PCIe Gen2, SRIO, HyperLink, and five-port Gigabit Ethernet switch

Applications

  • Mission Critical Systems
  • Cloud Computing and High-Performance Computing
  • Media Processing and Transcoding
  • Networking and Analytics Infrastructure

Procurement Notes

Verify the specific ordering suffix 'B' against the manufacturer's official documentation to confirm voltage grades or package revisions. Confirm that the required security accelerator functions are enabled for the specific shipment batch, as these features are subject to export control regulations.

Selection Notes

Select this model over the 66AK2H14 or 66AK2H12 if the application requires only four DSP cores and two ARM cores. Ensure the design accommodates the 1517-pin AAW BGA package dimensions of 40.0 mm x 40.0 mm. Verify thermal requirements for the extended case temperature range (-40°C to 100°C) if operating in harsh environments.

Part Context

This component belongs to the 66AK2Hxx family of multicore DSP+ARM SoCs based on the KeyStone II architecture. It shares the same package type and peripheral set as the 66AK2H14 and 66AK2H12, differing primarily in the number of active processor cores and associated shared memory capacity.

Replacement Considerations

Direct functional replacements within the same package include the 66AK2H12AAWA24 and 66AK2H14AAWA24. These devices offer higher core counts but maintain pin compatibility.

66AK2H06BAAWA2466AK2H06BAAWA24

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