66AK2H06BXAAW2

66AK2H06BXAAW2

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:eb0ec0591d63 Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06BXAAW2

Overview

The Texas Instruments 66AK2H06BXAAW2 is a KeyStone II System-on-Chip featuring four TMS320C66x DSP cores and two ARM Cortex-A15 processors. The C66x cores operate at up to 1.2 GHz, delivering 38.4 GMacs/core for fixed-point and 19.2 GFlops/core for floating-point processing. The ARM cores run at up to 1.4 GHz with 4 MB of shared L2 cache. The device includes 6 MB of MSMC SRAM, a Network Coprocessor with Packet and Security Accelerators, and peripherals such as USB 3.0, PCIe Gen2, and a five-port Ethernet switch. It is housed in a 1517-pin FCBGA package.

Feature Summary

  • Four TMS320C66x DSP cores (up to 1.2 GHz) and two ARM Cortex-A15 cores (up to 1.4 GHz)
  • Network Coprocessor with Packet Accelerator and Security Accelerator
  • Six megabytes of Multicore Shared Memory Controller (MSMC) SRAM
  • Peripherals include USB 3.0, PCIe Gen2, SRIO, HyperLink, and five-port Gigabit Ethernet switch

Applications

  • Cloud computing
  • Media processing
  • High-performance computing
  • Security applications
  • Virtual desktop infrastructure

Procurement Notes

Verify the specific suffix 'B' against official documentation to confirm silicon revision or manufacturing lot details. Confirm availability status directly with Texas Instruments or authorized distributors, as this component may be subject to production lifecycle changes.

Selection Notes

Select the 66AK2H06 variant when four DSP cores are sufficient for the application workload. Ensure the design supports the required DDR3/DDR3L memory interfaces and utilizes the KeyStone II architecture for multicore communication. Verify that the thermal solution accommodates the power consumption profile of the 1517-pin BGA package.

Part Context

This part belongs to the 66AK2Hxx family, which also includes the 66AK2H12 and 66AK2H14 models. These devices share the same KeyStone II architecture and package dimensions but differ in core counts and peripheral availability. The 66AK2H06 specifically provides a balanced configuration of four DSPs and two ARM cores.

Replacement Considerations

The 66AK2H12 and 66AK2H14 are compatible within the same family but offer higher core counts. Direct pin-to-pin replacement requires software adaptation to utilize additional resources. No other manufacturers produce functionally equivalent KeyStone II SoCs.

66AK2H06BXAAW266AK2H06BXAAW2

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