66AK2L06XCMS

66AK2L06XCMS

$449.17
  • Description:IC SOC MULTICORE DSP+ARM 900BGA
  • Series:66AK2Lx KeyStone Multicore

SKU:a0ddd75d9a62 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC MULTICORE DSP+ARM 900BGA
  • Series:66AK2Lx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
  • Clock Rate:1GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:5.384MB
  • Voltage - I/O:0.85V, 1.0V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:900-BFBGA, FCBGA
  • Supplier Device Package:900-FCBGA (25x25)
  • Grade:-
  • Qualification:-

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66AK2L06XCMS

Overview

The Texas Instruments 66AK2L06XCMS is a KeyStone II multicore System-on-Chip (SoC) integrating four TMS320C66x DSP cores and two ARM Cortex-A15 processors. Operating at frequencies up to 1.2 GHz, the device delivers high-performance fixed-point and floating-point processing. It features integrated JESD204A/B interfaces for direct connection to data converters, a Digital Front End (DFE), and hardware accelerators including FFT coprocessors, a Packet Accelerator, and a Security Accelerator. The SoC utilizes the KeyStone II architecture with a TeraNet switch fabric for non-blocking communication. It is housed in a 900-pin Flip-Chip BGA (CMS) package and supports an extended commercial temperature range of -40°C to +100°C.

Feature Summary

  • Four TMS320C66x DSP CorePacs operating up to 1.2 GHz with 38.4 GMACS/core performance
  • Dual ARM Cortex-A15 MPCore processors up to 1.2 GHz with 1 MB shared L2 cache
  • Integrated Digital Front End (DFE) supporting up to four lanes of JESD204A/B interface
  • Hardware accelerators including two Fast Fourier Transform Coprocessors (FFTC) and a Network Coprocessor (NETCP)

Applications

  • Avionics and Defense systems
  • Medical imaging and diagnostic equipment
  • Test and Measurement instrumentation
  • Industrial control applications

Procurement Notes

Verify that the 'X' prefix indicates an experimental device status, which may differ from fully qualified production units regarding reliability and failure rates. Confirm the specific silicon revision and security accelerator enablement status required for the target application. Ensure compliance with humidity sensitivity handling protocols during assembly.

Selection Notes

Select this model for applications requiring high-density signal processing with integrated ADC/DAC connectivity via JESD204B. The 1.2 GHz speed grade provides maximum computational throughput for complex algorithms. Consider the extended temperature range (-40°C to +100°C) for harsh environment deployments. Evaluate thermal management requirements given the 28nm process technology and core count.

Part Context

The 66AK2L06XCMS belongs to the 66AK2Lxx family within the C66x DSP series. It is designed as a low-power solution compared to multi-chip alternatives, leveraging the KeyStone II architecture for efficient resource sharing. The CMS suffix denotes the 900-pin plastic ball grid array package with lead-free solder balls.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Development teams should consult Texas Instruments directly for current availability and alternative component recommendations.

66AK2L06XCMS66AK2L06XCMS
$449.17
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