66AK2L06XCMSA

66AK2L06XCMSA

$493.08
  • Description:IC SOC MULTICORE DSP+ARM 900BGA
  • Series:66AK2Lx KeyStone Multicore

SKU:2b9cf941bf9e Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC MULTICORE DSP+ARM 900BGA
  • Series:66AK2Lx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
  • Clock Rate:1GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:5.384MB
  • Voltage - I/O:0.85V, 1.0V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:900-BFBGA, FCBGA
  • Supplier Device Package:900-FCBGA (25x25)
  • Grade:-
  • Qualification:-

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66AK2L06XCMSA

Overview

The Texas Instruments 66AK2L06XCMSA is a KeyStone II System-on-Chip integrating four TMS320C66x DSP cores and two ARM Cortex-A15 processors. Operating at frequencies up to 1.2 GHz, it delivers 38.4 GMACs/core for fixed-point and 19.2 GFLOPs/core for floating-point processing. The device features integrated JESD204A/B interfaces, a Digital Front End (DFE), and two Fast Fourier Transform Coprocessors (FFTC). It utilizes the KeyStone II architecture with a TeraNet switch for non-blocking communication and includes a Network Coprocessor with a four-port Gigabit Ethernet switch.

Feature Summary

  • Four C66x DSP cores and dual ARM Cortex-A15 processors operating up to 1.2 GHz
  • Integrated JESD204A/B interface supporting up to 7.37 Gbps line rate
  • Two FFT Coprocessors supporting up to 1200 Msps at FFT size 1024
  • KeyStone II architecture with TeraNet switch and Multicore Navigator

Applications

  • Avionics and Defense systems
  • Medical imaging equipment
  • Test and Measurement instruments
  • Industrial control applications

Procurement Notes

Verify the 'X' prefix in the part number indicates an experimental device not necessarily representative of final electrical specifications. Confirm the 'CMS' suffix corresponds to the 900-pin Flip-Chip Plastic BGA package. Ensure the temperature range matches the required operational environment, as the 'A' suffix denotes extended range (-40°C to +100°C) while the blank default is commercial (0°C to +100°C).

Selection Notes

Select this SoC for applications requiring high-performance signal processing with direct ADC/DAC connectivity via JESD204B. The integrated DFE and FFTC reduce external component count and power consumption compared to FPGA-based solutions. Ensure software development tools like Code Composer Studio and MCSDK are available for the specific silicon revision.

Part Context

The 66AK2L06XCMSA belongs to the 66AK2Lxx family within the KeyStone II architecture. It is designed as a low-power alternative to discrete FPGA and DSP combinations. The device supports both fixed-point and floating-point operations, offering backward compatibility with C64x+ software while providing enhanced vector processing capabilities.

Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material.

66AK2L06XCMSA66AK2L06XCMSA
$493.08
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