68771-110HLF

Headers, Male Pins Overview

The Amphenol ICC (FCI) 68771-110HLF is a high-speed backplane connector system component designed for demanding electronic applications. This specific part number refers to a receptacle assembly featuring a 110-position configuration, utilizing a 2.54 mm pitch spacing between contacts. The connector supports signal integrity requirements typical of modern data transmission standards through precise mechanical design and material selection. It employs a board-to-board or backplane mating interface, ensuring reliable electrical connectivity in multi-layer PCB architectures. The housing is constructed from thermoplastic materials rated for standard reflow soldering processes, with gold-plated contact surfaces to minimize insertion resistance and ensure long-term durability under repeated mating cycles.

Headers, Male Pins Feature Summary

• High-density 110-position layout optimized for space-constrained backplane environments
• Gold-plated contact surfaces engineered for low insertion force and reliable signal transmission
• Thermoplastic housing compatible with standard surface-mount technology assembly processes

Headers, Male Pins Applications

• Telecommunications infrastructure equipment requiring high-speed data interfaces
• Industrial control systems utilizing dense backplane architectures
• Computing hardware platforms needing reliable board-to-board interconnects

Headers, Male Pins Procurement Notes

Verify the exact suffix codes against the manufacturer's current datasheet to confirm plating thickness, housing color, and mounting style variations. Ensure compatibility with corresponding header components regarding pin count and row configuration. Cross-reference RoHS compliance status with the specific manufacturing batch documentation provided by the supplier. Confirm that the selected variant matches the required operating temperature range and mechanical retention specifications for the target application environment.

Headers, Male Pins Selection Notes

Select this component based on the required 110-contact count and 2.54 mm pitch dimensions. Evaluate the mating header counterpart to ensure mechanical alignment and electrical continuity. Consider the thermal management requirements during soldering and the mechanical stress limits imposed by the system enclosure. Verify that the connector's current rating per contact aligns with the power distribution needs of the circuit design without exceeding thermal thresholds.

Headers, Male Pins Part Context

This part belongs to the broader family of high-speed backplane connectors offered by Amphenol ICC. These systems are designed to support emerging data rates and higher channel counts in enterprise and telecom sectors. The 68771 series specifically addresses the need for robust interconnects in environments where signal integrity and mechanical stability are critical. Components within this line typically feature shielded options and varying contact lengths to accommodate different PCB stack-up heights and grounding requirements.

Headers, Male Pins Replacement Considerations

Direct replacements must match the 110-position count, 2.54 mm pitch, and mounting type. Verify that alternative suppliers offer identical housing dimensions and contact plating specifications to maintain mechanical fit and electrical performance. Ensure that any substitute component meets the same UL recognition and industry safety standards as the original part.