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The Broadcom Limited 6N134/883B is a high-reliability, Class H, dual-channel hermetically sealed optocoupler housed in a 16-pin ceramic DIP package. It features gold-plated and solder-dipped leads for robust connectivity. The device integrates an infrared LED input with photodiode and signal processing circuitry to deliver logic output via open-collector configurations. Key electrical specifications include a data rate of 10 Mb/s, an isolation voltage of 2500 Vrms (or 1500 Vdc), and a current transfer ratio of 100%. It provides a common-mode transient immunity of 1 kV/µs and operates within standard commercial temperature ranges.
Verify the specific ordering suffix, such as #200, to confirm reel packaging or tape-and-reel availability if required for automated assembly processes. Ensure the selected variant matches the lead finish requirements, typically gold-plated or solder-dipped, for compatible surface mounting or through-hole integration. Confirm that the 16-pin ceramic DIP form factor aligns with existing PCB footprint constraints and thermal management needs before finalizing procurement orders.
Select this component when dual-channel isolation with high-speed logic output is necessary. The 10 Mb/s data rate suits applications requiring rapid signal switching between isolated grounds. Consider the 16-pin ceramic DIP package size for board space limitations. Verify that the open-collector output type meets the pull-up resistor requirements of the destination logic family. Ensure the 2500 Vrms isolation rating satisfies the safety standards of the target application environment.
This part belongs to Broadcom's series of high-speed logic output optoisolators. It shares architectural similarities with other models in the family but distinguishes itself through its dual-channel configuration and hermetic sealing. The 6N134/883B serves as a specialized solution for environments where standard plastic-packaged optocouplers may lack sufficient durability or isolation performance.
Direct substitutes must match the 16-pin ceramic DIP package, dual-channel architecture, and 10 Mb/s speed. Verify equivalent isolation voltages and open-collector output types. Cross-reference pinouts to ensure compatibility without redesigning the host circuit board.