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6N136-560E is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 3.75KV TRANS W/BASE 8SMD. Review the specifications below when checking this part for your BOM.
The Broadcom Limited 6N136-560E is a high-speed optocoupler featuring a single channel with a phototransistor output. It operates at a data rate of 1 Mb/s and provides an isolation voltage of 3750 Vrms. The device utilizes a PDIP-8 Gull Wing package for surface mount installation. Key electrical parameters include a forward current of 16 mA, a forward voltage of 1.5 V, and an output current of 8 mA. Rise and fall times are specified at 800 ns each. The unit supports a power dissipation of 100 mW and functions within a temperature range of 0°C to +70°C.
Verify the specific suffix designation against official datasheets to confirm insulation class and packaging variations. Confirm RoHS compliance status through manufacturer documentation. Ensure the supplier provides valid traceability records. Cross-reference the part number with the latest engineering change notices to avoid obsolete stock. Validate that the received components match the specified PDIP-8 package dimensions.
Select this component when a 1 Mb/s data rate and 3750 Vrms isolation are required. Compare rise and fall times against system timing constraints. Evaluate the phototransistor output type against open-collector alternatives like the 6N137 series if higher drive currents are needed. Consider the operating temperature range relative to the application environment.
This part belongs to the 6N136 series of high-speed optocouplers manufactured by Broadcom Limited. The series is designed for applications demanding fast switching speeds and reliable electrical isolation. The 6N136-560E variant specifically denotes the tape and reel packaging configuration with enhanced insulation characteristics compared to standard DIP versions.
The 6N136-520E is a documented equivalent offering similar performance in a different packaging format. Verify pin compatibility and thermal characteristics before substitution.
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