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The Renesas Electronics Corporation 7005S15PF8 is a high-speed, asynchronous dual-port static random-access memory (SRAM) device. It provides a storage capacity of 64 kilobits organized as 8K words by 8 bits. The component features parallel interface access with a maximum access time of 15 nanoseconds. It operates on a single 5V power supply within a voltage range of 4.5V to 5.5V. The device is housed in a 64-pin Thin Quad Flat Package (TQFP) with dimensions of 14x14 mm and a pitch of 0.8 mm. It supports an industrial operating temperature range from 0°C to 70°C.
Verify component authenticity through authorized channels due to end-of-life status. Confirm package integrity and moisture sensitivity level handling procedures prior to assembly. Ensure compatibility with existing PCB footprints for the 64-TQFP configuration. Validate electrical specifications against current system requirements given the discontinuation. Review replacement options if long-term supply stability is critical for production.
Select this component when true dual-port functionality with hardware arbitration is required for asynchronous data sharing. Consider the 15 ns access speed and 64Kb density for intermediate buffering tasks. Evaluate the 64-TQFP package constraints against available board space. Assess the need for semaphore support to simplify software-driven synchronization protocols in multi-master environments.
The 7005S15PF8 belongs to the Renesas 7005 series of dual-port SRAMs, designed for high-performance data communication between processors. This specific variant offers a 15 ns access time, balancing speed and power efficiency. The series supports various package options including TQFP and PLCC, catering to different design integration needs. It serves as a key building block for systems requiring non-blocking memory access.
The 7005L15PFG8 is listed as an upgrade substitute by the manufacturer. Verify pinout compatibility and electrical parameter alignment before substitution. Check for any changes in package dimensions or thermal characteristics that may impact existing designs.