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The Renesas Electronics Corporation 7006S17PF is a high-speed, asynchronous dual-port static random access memory (SRAM) device. It features a storage capacity of 128 kilobits organized as 16K words by 8 bits. The component supports parallel interface communication with an access time of 17 nanoseconds. It operates on a single 5V power supply within a voltage range of 4.5V to 5.5V. The device is housed in a 64-pin Thin Quad Flatpack (TQFP) package designed for surface mount technology. The commercial temperature range specification extends from 0°C to +70°C.
Verify the current manufacturing status before procurement planning, as this specific part number may be discontinued or subject to end-of-life notices. Confirm that the 64-TQFP package dimensions match the target PCB footprint. Ensure the 0°C to 70°C commercial temperature rating aligns with the operational environment requirements. Check for RoHS compliance status relative to regulatory mandates in the destination market. Validate pin compatibility if substituting with newer revisions within the same family.
Select this component when a system requires true dual-port memory capabilities with asynchronous operation. The 17ns access speed suits applications needing moderate-to-high throughput without complex synchronization. The 128Kb density provides sufficient buffer space for small data structures. Consider the TQFP package for surface-mount assembly constraints. Evaluate the single 5V supply requirement against available power rails in the design.
The 7006 series represents a line of high-speed dual-port SRAMs originally developed by IDT and later acquired by Renesas Electronics. These devices are engineered for applications demanding simultaneous access from multiple processors or controllers. The 7006S17PF specifically denotes the commercial grade variant with 17ns timing specifications. This series is widely recognized for its robust semaphore-based arbitration mechanisms.
Publicly documented alternative part numbers include the 7006L15PFG. Verify electrical parameter compatibility, particularly access times and operating voltage ranges, before substitution. Confirm package pinout equivalence to ensure mechanical fit without PCB redesign.