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7007L55PFI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 256KBIT PARALLEL 80TQFP. Review the specifications below when checking this part for your BOM.
The 7007L55PFI is a dual-port asynchronous static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics Corporation. It provides a total storage capacity of 256 kilobits, organized as 32K words by 8 bits. The device features a parallel interface with a maximum access time and write cycle time of 55 nanoseconds. It operates within a supply voltage range of 4.5V to 5.5V and supports an industrial temperature range from 0°C to 70°C. The component is housed in a surface-mount 80-TQFP package measuring 14x14 mm.
Verify component authenticity through authorized distributors due to discontinuation status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Validate package integrity upon receipt, as moisture sensitivity level 3 requires proper handling. Check for obsolescence notices that may affect long-term supply chain stability.
Select this component when dual-port asynchronous SRAM functionality is required with 256Kb capacity. Ensure the design accommodates the 4.5V to 5.5V supply voltage range. Verify that the 80-TQFP package dimensions fit the target PCB layout constraints. Consider the 55ns access speed against system timing requirements for adequate performance margins.
This device belongs to the 7007L series of dual-port SRAMs from Renesas. It shares architectural similarities with other parts in the family but differs in specific capacity and pin configurations. The series is designed for applications requiring shared memory access between multiple masters without complex arbitration logic.
The 7007L55PFI is marked as obsolete. Potential substitutes include the IDT7007L55PF variant which maintains functional compatibility. Verify pinout and electrical specifications match before implementation.
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