7023887

Overview

The SICK model 7023887 is a Visionary-S CX industrial 3D snapshot vision sensor utilizing stereo vision principles. It integrates structured light illumination with color camera technology to provide real-time color depth images. The device features a resolution of 640 px x 512 px and delivers up to 30 color depth images per second. It operates within a temperature range of 0°C to 50°C, depending on the heatsink configuration, and offers an IP67 enclosure rating. Data output is provided via a Gigabit Ethernet interface.

Feature Summary

• Provides real-time color depth images by combining structured light illumination with mature color camera technology.
• Captures over 320,000 depth values and color intensity values in a single shot for high-resolution analysis.
• Operates reliably in absolute darkness or under maximum 40 klx daylight conditions.
• Outputs raw color and depth values directly via Ethernet after internal correlation.

Applications

• Robotics guidance and manipulation
• Internal logistics automation
• Quality assurance tasks in production

Procurement Notes

Verify that the specific ordering suffix corresponds to the required heatsink variant (short or long) to ensure compliance with the intended ambient operating temperature limits. Confirm the presence of the Gigabit Ethernet interface for data connectivity. Ensure compatibility with SOPAS ET software for configuration requirements.

Selection Notes

Select this model when direct access to raw correlated color and depth data is required without onboard processing logic. Choose the short heatsink variant for environments up to 40°C and the long heatsink variant for temperatures up to 50°C. This unit is suitable for fixed installations requiring high precision and speed.

Part Context

This component belongs to the Visionary-S series of 3D snapshot vision sensors from SICK. The CX variant specifically focuses on streaming raw data for external processing, distinguishing it from the AP variant which supports onboard application development via SICK AppSpace.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence regarding interface protocols and mechanical dimensions if considering alternative models.