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7024S35PFG8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 64KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 7024S35PFG8 is a dual-port static random access memory (SRAM) integrated circuit. It provides a storage capacity of 64 kilobits, organized as 4K words by 16 bits. The device features asynchronous parallel interface with an access time and write cycle time of 35 nanoseconds. It operates on a single 5V power supply ranging from 4.5V to 5.5V. The component is housed in a 100-pin Thin Quad Flat Package (TQFP) with a 14x14 mm footprint. It supports surface mount installation and functions within a commercial temperature range of 0°C to 70°C.
Verify the specific suffix PFG8 against official Renesas documentation to confirm package type and moisture sensitivity level. Confirm RoHS compliance status as older variants may differ. Check current production status as this model may be discontinued or subject to change notifications. Ensure the supplier provides valid traceability documents for quality assurance purposes.
Select this component when dual-master data exchange is required without complex arbitration logic. Compare access speeds and pin counts against alternative SRAM families if higher density is needed. Verify that the 100-pin TQFP package fits the available board space and thermal constraints. Ensure the 5V operating voltage matches the target system's power rails.
This part belongs to the Renesas 7024S35 series of dual-port SRAMs. It shares architectural similarities with other members like the 7024S35PF8 but differs in packaging and specific electrical characteristics. The series is designed for applications requiring fast, independent port access to shared memory resources.
Official upgrade alternatives include the 7024L15PFG8. Verify pinout compatibility and electrical specifications before substitution. Cross-reference datasheets to ensure functional equivalence in the target application.
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