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7025L20PFI8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 128KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 7025L20PFI8 is a dual-port static random access memory (SRAM) integrated circuit. It provides a storage capacity of 128 kilobits, organized as 8K words by 16 bits. The device features asynchronous parallel interface operation with a maximum access time of 20 nanoseconds. It operates within a supply voltage range of 4.5 volts to 5.5 volts and supports surface mount installation in a 100-pin Thin Quad Flat Package (TQFP). The component is designed for industrial temperature ranges spanning from -40°C to +85°C.
Verify RoHS compliance status carefully, as historical records indicate variations between non-compliant and compliant versions for this part number. Confirm the specific suffix designation matches the required environmental standard for your assembly process. Check current availability as stock levels fluctuate due to discontinuation notices. Ensure the package type corresponds exactly to your PCB footprint requirements before finalizing orders.
Select this component when dual-port functionality is required for concurrent host and peripheral access. Compare against single-port alternatives if only one master device interfaces with the memory. Evaluate the 20 ns access speed against system clock requirements to ensure timing margins are sufficient. Consider the 100-pin TQFP package constraints regarding board space and thermal dissipation capabilities.
This device belongs to the Renesas 7025 series of high-performance dual-port SRAMs. It succeeds earlier generations such as the IDT7025L20PFI, maintaining pin compatibility while potentially offering updated manufacturing processes. The series is widely used in legacy designs requiring reliable, fast, independent port access for complex data handling tasks.
The 7025L20PFGI8 is listed as an upgrade alternative. Verify that the package variant change does not impact mechanical fit or soldering profiles. Confirm electrical parameter equivalence to ensure seamless integration into existing circuits.
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