7025L35PF8

Memory IC Overview

The Renesas Electronics Corporation 7025L35PF8 is a dual-port static random-access memory (SRAM) integrated circuit. It provides a storage capacity of 128 kilobits, organized as 8K words by 16 bits. The device features asynchronous parallel interface operation with a maximum access time of 35 nanoseconds. It operates on a single 4.5V to 5.5V power supply and supports surface-mount installation in a 100-pin Thin Quad Flat Package (TQFP). The component is designed for industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

• Supports simultaneous independent read and write operations through two separate ports without bus contention.
• Includes on-chip hardware semaphore signaling logic to manage data integrity during concurrent port access.
• Features automatic power-down functionality controlled by chip enable signals to minimize standby current consumption.

Memory IC Applications

• High-speed data buffering in telecommunications equipment
• Cache memory implementation in embedded processing systems
• Data logging applications requiring non-volatile retention via battery backup

Memory IC Procurement Notes

Verify the specific suffix configuration against official datasheets to ensure correct package type and temperature rating. Confirm RoHS compliance status as older variants may not meet current environmental standards. Check manufacturer discontinuation notices for availability constraints. Validate pinout compatibility with existing PCB layouts before integration.

Memory IC Selection Notes

Select this component when true dual-port architecture is required for simultaneous multi-processor access. Ensure system voltage requirements align with the specified 5V supply range. Consider the 35ns access speed relative to processor clock cycles. Verify that the 100-pin TQFP package fits within the mechanical design constraints of the target application.

Memory IC Part Context

This part belongs to the Renesas 7025 series of high-speed dual-port SRAMs. The series offers various access speeds and package options to suit different performance and form factor requirements. These devices are commonly used in systems needing shared memory resources between multiple masters.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers were not identified in the provided source material. Consult manufacturer documentation for potential upgrades or cross-references.