Memory IC 70261L25PFG product image

70261L25PFG

  • Description:IC SRAM 256KBIT PARALLEL 100TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:575260602455 Category: Brand:

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70261L25PFG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 256KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70261L25PFG

  • Description:IC SRAM 256KBIT PARALLEL 100TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Asynchronous
  • Memory Size:256Kbit
  • Memory Organization:16K x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:25ns
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Supplier Device Package:100-TQFP (14x14)
  • Access Time:25 ns

Memory IC datasheet and documents for 70261L25PFG

70261L25PFG

Memory IC Overview

The Renesas Electronics Corporation 70261L25PFG is an asynchronous dual-port static random-access memory (SRAM) integrated circuit. It features a storage capacity of 256 kbit organized as 16k x 16 words. The device supports a parallel interface with a maximum access time of 25 ns. It operates within a supply voltage range of 3 V to 3.6 V and has a maximum power supply current of 185 mA. The component is designed for surface mount installation in a TQFP-100 package. It functions reliably across an extended industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Provides independent read/write ports for simultaneous data access by two masters
  • Supports single data rate asynchronous operation for flexible system integration
  • Operates on a single 3.3V power supply compatible with standard logic levels

Memory IC Applications

  • High-speed data buffering in telecommunications equipment
  • Cache memory implementation in embedded processing systems
  • Data logging applications requiring rapid write cycles

Memory IC Procurement Notes

Verify the specific suffix designation against official Renesas documentation, as variations such as PFGI or PFGI8 indicate differences in packaging or RoHS compliance status. Confirm that the required lead times align with production schedules, as manufacturing cycles may vary based on regional availability and factory allocation. Ensure compatibility with existing board designs regarding pinout and thermal requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when dual-port functionality is required for concurrent master access without arbitration overhead. The 25 ns speed grade offers a balance between performance and power consumption suitable for general-purpose industrial applications. Consider the TQFP-100 package dimensions for PCB layout constraints and ensure the operating environment remains within the specified -40°C to +85°C temperature limits for reliable long-term operation.

Memory IC Part Context

This part belongs to the Renesas 70V261L series of low-power dual-port SRAMs. It serves as a successor or alternative to older generations like the 70V26S series, offering improved power efficiency and modern packaging options. The L-series typically denotes lower power consumption characteristics compared to standard variants, making it suitable for battery-operated or thermally constrained environments.

Memory IC Replacement Considerations

The 70V261L25PFGI is documented as a verified substitute for the discontinued 70V26S25JI. Verify pin-to-pin compatibility and electrical specifications before swapping components in existing designs.

70261L25PFG70261L25PFG

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