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70261L55PFG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 256KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The 70261L55PFG is a high-speed 16K x 16 Dual-Port Static RAM designed for standalone or master/slave configurations in 32-bit systems. It features true dual-ported memory cells allowing simultaneous access to the same location, separate upper-byte and lower-byte control for multiplexed bus compatibility, and on-chip port arbitration logic with semaphore signaling support. The device operates asynchronously from either port using a TTL-compatible single 5V power supply and includes automatic power-down features controlled by chip enable inputs.
Verify RoHS compliance status and moisture sensitivity level before procurement. Confirm package type matches design requirements. Check current availability as this component may be subject to discontinuation notices. Ensure voltage specifications align with system power rails. Validate lead-free status if required by environmental regulations.
Select this component when simultaneous bidirectional access to shared memory is required without external arbitration circuitry. Suitable for applications needing hardware-based semaphore signaling between processors. Consider operating temperature range and package constraints during selection. Verify power consumption characteristics against system thermal limits.
Part of the Renesas 70261 series dual-port SRAM family offering various access times and packaging options. Designed for industrial and commercial applications requiring reliable high-speed memory sharing capabilities. Manufactured using advanced CMOS technology for improved performance and reduced power consumption compared to earlier generations.
Check for direct pin-to-pin replacements within the 70261 series such as different access time variants. Verify functional compatibility regarding semaphore and interrupt flag operations. Confirm package dimensions and lead pitch match existing PCB layouts.
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