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70261S35PF8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 256KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 70261S35PF8 is a high-speed, asynchronous dual-port static random-access memory (SRAM) integrated circuit. It features a storage capacity of 256 kilobits organized as 16K words by 16 bits. The device supports parallel interface operation with an access time and write cycle time of 35 nanoseconds. It operates on a single 4.5V to 5.5V power supply and is housed in a 100-pin Thin Quad Flat Package measuring 14x14 millimeters. This component is designed for applications requiring simultaneous independent access from two ports.
This part number is officially discontinued and no longer manufactured by Renesas Electronics Corporation. Verification of availability should focus on identifying approved upgrade alternatives rather than sourcing new units. Confirm that any replacement components maintain compatibility with existing system requirements before procurement.
Designers must account for the discontinuation status when selecting this component. The official upgrade path involves transitioning to the 70261L series, which offers improved performance specifications. Ensure that the replacement package type and pinout remain compatible with the current printed circuit board layout to minimize redesign efforts.
The 70261S35PF8 belongs to the Renesas 70261 family of high-speed dual-port SRAMs. This family is engineered for applications demanding fast, independent access from multiple processors or controllers. The specific suffix indicates a commercial temperature range and tape-and-reel packaging format, distinguishing it from industrial grade or tray-packaged variants within the same functional family.
The official upgrade substitute is the 70261L20PFGI8. This replacement provides faster access times while maintaining the same dual-port functionality and package dimensions.
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