7026L20J

Memory IC Overview

The Renesas Electronics Corporation 7026L20J is a high-speed, dual-port static random access memory (SRAM) integrated circuit. It features a storage capacity of 256 kbit organized as 16k x 16 words. The device supports parallel asynchronous interfaces with a typical access time of 20 ns. It operates within a supply voltage range of 4.5 V to 5.5 V and is designed for surface-mount installation in PLCC-84 packages. The component functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Dual-port architecture enabling independent simultaneous access by two processors
• High-speed asynchronous operation with fast data transfer rates
• Robust industrial-grade thermal stability for demanding environments

Memory IC Applications

• Network switch buffer memory management
• Telecommunications equipment data buffering
• Industrial control system temporary storage

Memory IC Procurement Notes

Verify the exact suffix designation, as the base model number may correspond to multiple package variants such as JGI or JGB. Confirm RoHS compliance status and moisture sensitivity levels prior to integration. Check current lifecycle status, as this series may be subject to discontinuation notices. Ensure compatibility with existing PCB footprints and power delivery specifications during procurement planning.

Memory IC Selection Notes

Select this component when dual-port functionality is required for concurrent processor access without external arbitration logic. The 16-bit word width suits applications needing wide data buses. Verify that the 5V operating voltage aligns with the target system's power rails. Consider the PLCC-84 package constraints regarding board space and thermal dissipation requirements compared to alternative surface-mount options.

Memory IC Part Context

This part belongs to the 7026L series of high-speed dual-port SRAMs manufactured by Renesas Electronics. The series is characterized by its ability to support complex data handling tasks in networking and telecommunications infrastructure. Variants within the family typically share similar electrical characteristics but differ in packaging and specific speed grades.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Engineering changes should be validated against original manufacturer specifications.