7027L35PF8

Memory IC Overview

The 7027L35PF8 is a high-speed 32K x 16 Dual-Port Static RAM designed for standalone 512K-bit applications or as a master/slave combination in 32-bit systems. It features asynchronous parallel interface with 35 ns access time and operates on a 5.0 V supply. The device supports automatic power-down modes for low standby power consumption. It is housed in a 100-pin TQFP package suitable for surface mount installation.

Memory IC Feature Summary

• Dual-port architecture enabling independent simultaneous access by two processors
• Automatic power-down feature reduces standby current consumption
• Asynchronous parallel interface compatible with standard logic families

Memory IC Applications

• Standalone dual-port memory modules
• Master/slave configurations in 32-bit or wider data bus systems
• High-speed data buffering between asynchronous components

Memory IC Procurement Notes

Verify component authenticity through authorized distributors due to discontinuation status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Check moisture sensitivity level handling procedures before PCB assembly. Validate pinout compatibility with existing designs referencing IDT equivalents.

Memory IC Selection Notes

Select this component when dual independent port access is required for 32-bit wide data paths. Ensure system voltage aligns with 5.0 V TTL specifications. Consider thermal management for TQFP-100 packaging density. Evaluate timing constraints against 35 ns access speed requirements for target application performance.

Memory IC Part Context

Part of the 7027 series high-speed dual-port SRAM family manufactured by Renesas Electronics. Originally developed under IDT branding, now integrated into Renesas product portfolio. Designed for industrial temperature ranges and robust operation in embedded systems requiring reliable concurrent memory access capabilities.

Memory IC Replacement Considerations

IDT7027L35PF8 serves as a direct equivalent prior to acquisition consolidation. Verify pin-to-pin compatibility and electrical parameter alignment before substitution. Review updated datasheets for any functional differences introduced during manufacturer transition.