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7027L55PF8/2909 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 512KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 7027L55PF8/2909 is a dual-port static random-access memory (SRAM) integrated circuit. It provides a storage capacity of 512 kilobits, organized as 32K words by 16 bits. The device utilizes an asynchronous parallel interface with a maximum access time of 55 nanoseconds. It operates on a single 4.5V to 5.5V power supply and supports surface-mount installation in a 100-lead Thin Quad Flat Pack package measuring 14x14 millimeters. The component functions within a commercial temperature range of 0°C to 70°C.
Verify the specific suffix designation against official manufacturer documentation to confirm exact packaging configuration and lead-free status. Confirm RoHS compliance requirements prior to integration. Ensure the selected variant matches the required thermal grade for the intended operating environment. Cross-reference part numbers with authorized distributors to avoid obsolete or counterfeit inventory sources.
Select this component when a system requires true dual-port memory architecture for concurrent data handling between independent processors. The 55-nanosecond access speed suits moderate-to-high throughput applications where deterministic latency is critical. Evaluate the 100-pin TQFP footprint against available board space constraints. Consider the 5-volt logic compatibility for direct interfacing with standard microcontrollers.
This device belongs to the Renesas 7027L series of dual-port SRAMs, designed for high-performance embedded applications. The series offers various access speeds and organization options to accommodate different bandwidth requirements. The 7027L family maintains pin compatibility across certain variants to simplify design upgrades.
Consult official substitution guides for equivalent dual-port SRAM devices with matching 512Kb capacity and 100-pin TQFP packages. Verify electrical parameter alignment before replacing existing components in production hardware.
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