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7027S25PF is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 512KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 7027S25PF is a high-speed, 512-kbit Dual-Port Static Random Access Memory (SRAM) organized as 32K words by 16 bits. It operates on a single 5.0V power supply with a voltage range of 4.5V to 5.5V. The device features an asynchronous parallel interface and supports access times of 25 nanoseconds. Designed for surface-mount applications, it is housed in a 100-pin Thin Quad Flat Package (TQFP). The component includes automatic power-down capabilities to minimize standby current consumption.
Verify component authenticity through authorized channels due to potential availability of refurbished units. Confirm RoHS compliance status as older variants may not meet current environmental directives. Validate package integrity upon receipt, as moisture sensitivity requires proper handling. Check for specific suffix variations that may indicate different temperature grades or packaging formats.
Select this component when independent dual-access memory is required for high-throughput data exchange. Ensure the design accommodates the 100-pin TQFP footprint and thermal requirements. Verify that the 5V logic levels match the interfacing microprocessors. Consider the 25ns access speed against system latency requirements before finalizing the bill of materials.
This part belongs to the 7027 series of dual-port SRAMs, which are engineered for high-performance data storage applications. The series typically offers various access speeds and organizational configurations to suit different bandwidth needs. These devices are commonly utilized in telecommunications, industrial automation, and computing systems requiring reliable, fast memory sharing between multiple controllers.
Consult official manufacturer documentation for qualified pin-compatible alternatives within the same product family. Verify that any substitute maintains identical dual-port functionality and electrical characteristics. Cross-reference package dimensions to ensure mechanical fit within the existing assembly constraints.
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