7027S25PFI

Memory IC Overview

The Renesas Electronics Corporation 7027S25PFI is a dual-port static random access memory (SRAM) integrated circuit. It provides a storage capacity of 128 kbit, organized as 8K words by 16 bits. The device features asynchronous parallel interface with a maximum access time of 25 ns. It operates within a supply voltage range of 4.5 V to 5.5 V and supports surface-mount installation in a 100-pin TQFP package.

Memory IC Feature Summary

• Dual-port architecture enabling independent simultaneous read/write operations on separate ports
• Asynchronous operation for flexible system integration without clock synchronization requirements
• Parallel data interface supporting standard high-speed memory bus connections

Memory IC Applications

• High-performance embedded systems requiring concurrent data access
• Industrial control units needing fast buffer memory
• Telecommunications equipment data processing modules

Memory IC Procurement Notes

Verify component authenticity through authorized distributors due to obsolescence status. Confirm RoHS compliance and lead times as availability is limited. Validate package integrity upon receipt to ensure pin alignment matches the 100-TQFP specification before soldering.

Memory IC Selection Notes

Select this part when dual-port functionality is required for 128 kbit capacity. Ensure the design supports 5V logic levels and 25 ns timing constraints. Consider the 100-TQFP footprint for PCB layout compatibility and thermal management requirements during assembly.

Memory IC Part Context

This component belongs to the Renesas 7027 series of dual-port SRAMs. It shares architectural similarities with other members like the 7027L25G but differs in package type and specific speed grades. The series targets applications demanding reliable, high-speed volatile memory with independent port access capabilities.

Memory IC Replacement Considerations

Direct substitutes include the 7027L25PFGI. Verify pinout compatibility and electrical specifications before substitution. Alternative packages may require adapter solutions or PCB redesign.