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7027S35PFI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 512KBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The 7027S35PFI is a high-speed, asynchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. It provides a storage capacity of 512Kb organized as 32K words by 16 bits. The device features parallel interface access with a maximum access time and write cycle time of 20 ns. It operates on a single 4.5V to 5.5V power supply and supports an industrial temperature range from -40°C to +85°C. The component is housed in a 100-pin Thin Quad Flat Package (TQFP) measuring 14x14 mm.
This component has reached end-of-life status and is no longer manufactured. Verify availability through authorized distributors for remaining stock or consider approved replacement parts. Ensure compliance with RoHS directives if required, as this specific part may not meet current environmental standards. Confirm package authenticity and moisture sensitivity handling procedures upon receipt.
Select this part for applications requiring true dual-port memory with 20 ns speed and 512Kb capacity. Ensure the design accommodates the 100-TQFP package dimensions and 4.5V to 5.5V voltage requirements. Consider the industrial temperature range suitability for harsh environments. Evaluate alternative components if lead times or obsolescence pose risks to production schedules.
The 7027 series represents Renesas' line of high-speed dual-port SRAMs designed for complex system architectures. This specific model offers a balance of density and speed suitable for demanding embedded applications. The S suffix typically denotes the industrial temperature grade, distinguishing it from commercial variants within the same family.
Direct replacements include the 7027L20PFGI. Verify pin compatibility and electrical specifications before substitution. The replacement may offer updated manufacturing processes or packaging options while maintaining functional equivalence.
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