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7035S12PF is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 144K PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.
The Renesas 7035S12PF is a high-speed 8K x 18 Dual-Port Static RAM with a 144K-bit density. It features asynchronous parallel interface and 12 ns access time. Operating on a single 5V supply, it supports simultaneous reads of the same memory location via true dual-port architecture. The device includes on-chip arbitration, semaphore signaling, and interrupt flags for master/slave configurations. It is housed in a 100-pin TQFP package.
Verify the specific suffix 'S' indicates the commercial temperature range (0°C to +70°C) as opposed to industrial variants. Confirm package type is 100-pin TQFP. Check current status as some 7035 variants are obsolete; ensure the S12PF designation matches active procurement channels. Validate moisture sensitivity level and lead-free status against the specific datasheet revision.
Select this component when a 5V TTL-compatible dual-port SRAM with 12 ns speed is required. It is suitable for applications needing simultaneous access to shared memory locations without external arbitration logic. Consider the 100-pin TQFP footprint for PCB layout constraints. Ensure system voltage aligns with the single 5V supply requirement and verify temperature range sufficiency for the operating environment.
The 7035 series represents Renesas's high-performance dual-port SRAM line derived from IDT technology. These devices are designed to eliminate the need for discrete logic in multi-processor systems. The 7035S12PF specifically targets cost-sensitive commercial applications requiring fast, reliable data sharing between two independent masters.
Cross-reference with IDT 7035L12PFG for industrial temperature equivalents. Verify pinout and electrical characteristics match before substitution. Note that suffix changes may indicate different temperature grades or packaging options rather than functional differences.
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