70T3319S133BC

Memory IC Overview

The 70T3319S133BC is a high-speed synchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. It features a memory organization of 256K x 18 bits, providing a total capacity of 4.5 Mbits. The device supports parallel interface operations with a maximum clock frequency of 133 MHz and an access time of 4.2 ns. It operates within a supply voltage range of 2.4V to 2.6V for the core and utilizes a 256-pin CABGA package measuring 17x17 mm. The component is designed for applications requiring simultaneous bidirectional data flow.

Memory IC Feature Summary

• Supports simultaneous independent access to the same memory location from both ports
• Features selectable pipelined or flow-through output modes for flexible system integration
• Includes JTAG functionality for boundary scan testing and debugging capabilities
• Offers automatic power-down control via chip enable signals for low standby power consumption

Memory IC Applications

• High-speed networking equipment requiring burst data buffering
• Telecommunications systems utilizing unidirectional or bidirectional data flows
• Industrial control systems needing reliable synchronous memory storage
• Embedded systems requiring dual-port architecture for concurrent processing

Memory IC Procurement Notes

Verify the specific suffix designation against official Renesas documentation to confirm pinout compatibility and electrical characteristics. Confirm RoHS compliance status as older batches may not meet current environmental standards. Check for product discontinuation notices or end-of-life notifications prior to finalizing procurement plans. Ensure that the selected package variant matches the intended PCB footprint and thermal requirements.

Memory IC Selection Notes

Select this component when a synchronous dual-port SRAM with 18-bit word width is required for high-frequency data handling. Consider the 133 MHz operating speed and 4.2 ns access time for latency-sensitive designs. Evaluate the 256-pin CABGA package constraints regarding board space and soldering complexity. Compare power consumption profiles between pipelined and flow-through modes based on application throughput needs.

Memory IC Part Context

This part belongs to the 70T3319 series of synchronous dual-port RAMs, optimized for high-performance memory applications. The series typically includes variants with different speeds and package options, such as TQFP or fpBGA configurations. These devices are engineered to support complex data structures in networking and industrial environments where simultaneous port access is critical for system efficiency.

Memory IC Replacement Considerations

Consult official Renesas datasheets for verified cross-reference part numbers. Verify that any substitute maintains identical 256K x 18 organization and 133 MHz speed. Ensure package dimensions and pin assignments match the existing design to avoid hardware modifications.