70T3319S133BF8

$140.42

Description：IC SRAM 4.5MBIT PAR 208CABGA
Series：-
Mfr：Renesas Electronics Corporation
Package：Tape & Reel (TR)

SKU:f1a10446e57e Category: Memory IC Brand: Renesas Electronics Corporation

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Product introduction

70T3319S133BF8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 4.5MBIT PAR 208CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70T3319S133BF8

Description：IC SRAM 4.5MBIT PAR 208CABGA
Series：-
Mfr：Renesas Electronics Corporation
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Dual Port, Synchronous
Memory Size：4.5Mbit
Memory Organization：256K x 18
Memory Interface：Parallel
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.4V ~ 2.6V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：208-LFBGA
Supplier Device Package：208-CABGA (15x15)
Access Time：4.2 ns

Memory IC datasheet and documents for 70T3319S133BF8

70T3319S133BF8

Memory IC Overview

The 70T3319S133BF8 is a high-speed synchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics. It features a storage organization of 256K x 18 bits, providing a total capacity of 4.5 Mbit. The device supports a maximum clock frequency of 133 MHz with an access time of 4.2 ns. It operates on a parallel interface and requires a supply voltage between 2.4V and 2.6V. The component is housed in a 208-CABGA package measuring 15x15 mm.

Memory IC Feature Summary

Supports simultaneous independent access to the same memory location from both ports
Features selectable pipelined or flow-through output modes for flexible data handling
Includes JTAG functionality for boundary scan testing and system diagnostics

Memory IC Applications

High-speed data buffering in telecommunications equipment
Network switching and routing applications requiring low latency
Industrial control systems needing reliable dual-port memory

Memory IC Procurement Notes

Verify current availability status as this part may be discontinued. Confirm that the 208-CABGA package dimensions match your PCB footprint requirements. Ensure power supply rails strictly adhere to the 2.4V to 2.6V specification to prevent operational failure. Check for moisture sensitivity level constraints during assembly processing.

Memory IC Selection Notes

Select this component when dual-port architecture is required for concurrent read/write operations without arbitration logic. Consider the 208-pin BGA package if space efficiency is critical. Verify compatibility with 2.5V I/O levels and ensure the design supports the specific 4.2 ns access time requirements for the target application speed.

Memory IC Part Context

This device belongs to the 70T3319 series of synchronous dual-port SRAMs. It is designed for applications demanding high bandwidth and low latency. The series typically offers interleaved I/Os and separate byte controls for bus matching. It is optimized for burst data flows in unidirectional or bidirectional directions.