70T3319S166BFG

Memory IC Overview

The 70T3319S166BFG is a synchronous dual-port SRAM with a 4.5 Mbit capacity organized as 256K x 18 bits. It operates at a maximum clock frequency of 166 MHz with a 3.6 ns access time. The device supports parallel interface and requires a supply voltage between 2.4V and 2.6V. It is housed in a 208-CABGA package measuring 15x15 mm and functions within a commercial temperature range of 0°C to 70°C.

Memory IC Feature Summary

• Dual-port architecture enabling simultaneous independent access to memory locations by two separate controllers.
• Full synchronous operation on both ports for high-speed data transfer in burst applications.
• Automatic power-down feature controlled by chip enables to minimize standby power consumption.

Memory IC Applications

• Network routers and switches requiring high-bandwidth packet buffering
• Telecommunications equipment utilizing bidirectional data flow
• Industrial automation systems needing fast synchronous memory access

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to discontinuation status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Validate package integrity upon receipt, ensuring no damage to the CABGA pins. Check datasheet revisions for any pinout or electrical parameter updates prior to final design integration.

Memory IC Selection Notes

Select this component when simultaneous read/write operations are required without bus contention. Ensure the system design accommodates the specific 2.4V to 2.6V I/O voltage range. Verify that the 208-pin footprint fits the PCB layout constraints. Consider thermal management for the commercial temperature grade if ambient conditions approach the upper limit.

Memory IC Part Context

This part belongs to the Renesas 70T3319 series of high-speed synchronous dual-port RAMs. It is designed for applications demanding unidirectional or bidirectional data flow in bursts. The series offers optimized performance for network and telecommunications infrastructure where low latency and high throughput are critical.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. The manufacturer has issued a product discontinuance notification for this family. Designers should evaluate alternative memory solutions or contact the manufacturer directly for potential last-time buy options or approved replacements.