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70T3319S166BFG8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 4.5MBIT PAR 208CABGA. Review the specifications below when checking this part for your BOM.
The 70T3319S166BFG8 is a high-speed synchronous dual-port static random-access memory (SRAM) with a density of 4.5 Mbit, organized as 256K by 18 bits. It operates at a maximum clock frequency of 166 MHz with an access time of 3.6 ns. The device supports parallel interface and accepts a supply voltage range of 2.4V to 2.6V. It is housed in a 208-pin CABGA package measuring 15x15 mm and functions within an industrial temperature range of 0°C to 70°C.
This component has reached end-of-life status and is officially discontinued by Renesas Electronics. Availability is strictly limited to existing stock held by authorized distributors or secondary market suppliers. Buyers must verify part authenticity and physical condition carefully due to the age of remaining inventory. Supply chain continuity cannot be guaranteed, and long-term procurement planning should account for potential sourcing difficulties.
Engineers selecting this part must consider its discontinuation status when designing new products. The device requires a specific 2.4V to 2.6V supply voltage range, which differs from standard 3.3V logic levels. Designers should evaluate alternative components that offer similar 166 MHz performance and 256K x 18 organization but are currently in active production to ensure future supply stability.
The 70T3319S166BFG8 belongs to the 70T3319 series of synchronous dual-port SRAMs manufactured by Renesas Electronics. This series is engineered for applications demanding high-speed data handling and simultaneous port access. The specific BFG8 suffix indicates the 208-pin CABGA packaging variant, distinguishing it from other package options like TQFP or standard BGA found within the broader product family.
Publicly confirmed substitute part numbers are not available in the provided documentation. Due to the end-of-life status, direct pin-to-pin replacements may require schematic redesign. Engineers should consult Renesas technical resources for current portfolio alternatives that match the required speed and density specifications.
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