70T3339S133BFGI

Memory IC Overview

The Renesas Electronics Corporation 70T3339S133BFGI is a synchronous dual-port static random access memory (SRAM) integrated circuit. It features a storage capacity of 9 megabits organized as 512K by 18 bits. The device operates with a parallel interface and supports a maximum clock frequency of 133 MHz, achieving an access time of 4.2 nanoseconds. It functions within a supply voltage range of 2.4 volts to 2.6 volts and is rated for an operating temperature range from -40 degrees Celsius to 85 degrees Celsius. The component is housed in a 208-lead CABGA package measuring 15 by 15 millimeters.

Memory IC Feature Summary

• Supports simultaneous independent read and write operations at both port A and port B through its dual-port architecture.
• Integrates collision detection logic to manage data conflicts when both ports attempt to access the same address simultaneously.
• Utilizes a synchronous parallel interface synchronized by a single clock signal for predictable timing performance.
• Includes built-in counters and interrupt capabilities to assist with system monitoring and control tasks.

Memory IC Applications

• High-speed digital signal processing systems requiring low-latency data buffering
• Network communication equipment utilizing packet switching and routing
• Industrial automation controllers needing reliable real-time data handling
• Test and measurement instruments requiring fast memory access cycles

Memory IC Procurement Notes

This component has been officially discontinued by the manufacturer. Production has ceased, and no new units are available from authorized channels. Buyers must verify the authenticity of existing stock carefully due to potential obsolescence risks. Supply availability is limited to remaining inventory held by distributors or third-party sellers. Engineering teams should initiate design changes immediately to mitigate long-term maintenance issues associated with end-of-life components.

Memory IC Selection Notes

Engineers selecting this part must account for its discontinued status and plan for future redesigns. The 208-CABGA package requires specific surface-mount printing and soldering profiles during assembly. Verify that the target system provides stable 2.5V power rails within the specified tolerance. Ensure PCB layout accommodates the 15x15mm footprint and thermal requirements for industrial temperature ranges. Consider alternative modern SRAM devices if long-term supply continuity is a critical project requirement.

Memory IC Part Context

The 70T3339S133BFGI belongs to the Renesas 70T3339 series of high-performance synchronous dual-port RAMs. This family is designed for applications demanding high bandwidth and deterministic access times. The device shares architectural similarities with other members like the 70T3319 and 70T3399, differing primarily in density and pinout configurations. It represents a specialized memory solution for complex embedded systems requiring concurrent data access.

Memory IC Replacement Considerations

• IDT70T3339S133BFGI

Memory IC FAQ

What is the function of the collision detection feature?

Collision detection identifies instances where both Port A and Port B attempt to access the same memory address simultaneously, allowing the system to handle the conflict according to predefined priority rules.

Does this SRAM support pipelined output?

Yes, the device supports pipelined output modes, which can improve throughput by overlapping access cycles for sequential data reads.