Memory IC 70T3339S166BC product image

70T3339S166BC

$206.47
  • Description:IC SRAM 9MBIT PARALLEL 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:72ba783f3d16 Category: Brand:

  
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70T3339S166BC is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 9MBIT PARALLEL 256CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70T3339S166BC

  • Description:IC SRAM 9MBIT PARALLEL 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Synchronous
  • Memory Size:9Mbit
  • Memory Organization:512K x 18
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.4V ~ 2.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-CABGA (17x17)
  • Access Time:3.6 ns

Memory IC datasheet and documents for 70T3339S166BC

70T3339S166BC

Memory IC Overview

The 70T3339S166BC is a high-speed synchronous dual-port static random-access memory manufactured by Renesas Electronics. It features a memory organization of 512K x 36 bits, providing a total capacity of 18 Mbit. The device supports an I/O clock frequency of 166 MHz with a corresponding access time of 3.6 ns. It operates on a single 2.5V power supply for both the core and I/Os. The component is housed in a 256-pin CABGA package measuring 17.0 mm by 17.0 mm. It includes JTAG functionality and selectable output modes.

Memory IC Feature Summary

  • Dual-port architecture enables simultaneous independent access to shared memory locations from two distinct processors or systems.
  • Supports selectable pipelined or flow-through output modes to optimize data throughput based on specific application latency requirements.
  • Integrates JTAG boundary scan capability within the BGA package for enhanced manufacturing testability and system diagnostics.
  • Features automatic power-down control via chip enable signals to minimize standby power consumption during idle periods.

Memory IC Applications

  • High-performance networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure utilizing synchronous data transfer protocols
  • Industrial automation systems demanding reliable dual-processor data exchange

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to potential availability constraints. Confirm RoHS compliance status as some variants may not meet current environmental standards. Validate package integrity upon receipt to ensure proper pin alignment. Check datasheet revisions for any functional updates prior to final design integration.

Memory IC Selection Notes

Select this component when 18-bit wide data paths and 166 MHz synchronous operation are required. Ensure the design accommodates the 256-pin CABGA footprint and thermal characteristics. Verify that the system voltage aligns with the specified 2.5V requirement for both core and I/O domains.

Memory IC Part Context

This part belongs to the 70T3339 series of synchronous dual-port SRAMs. It shares architectural similarities with other members like the 70T3319 but differs in data width and density. The series is designed for burst data flow applications in unidirectional or bidirectional configurations.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include IDT70T3339S166BC and 70T3339S166BCI. Verify pin compatibility and electrical specifications before substitution.

70T3339S166BC70T3339S166BC
$206.47
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