70T3339S166BC8

Memory IC Overview

The 70T3339S166BC8 is a high-speed synchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. It features a memory organization of 256K x 18 bits, providing a total density of 4608 Kb. The device supports an I/O frequency of up to 166 MHz and operates with a core voltage of 2.5V. It utilizes a 256-pin CABGA package with a pitch of 1 mm and dimensions of 17.0 x 17.0 x 1.4 mm. The component is designed for applications requiring unidirectional or bidirectional data flow in bursts.

Memory IC Feature Summary

• Supports simultaneous access to the same memory location from both ports
• Features selectable pipelined or flow-through output modes
• Includes JTAG functionality for testing and debugging
• Offers automatic power-down capabilities controlled by chip enables

Memory IC Applications

• High-speed data buffering in network equipment
• Cache memory systems in embedded processors
• Data storage in telecommunications infrastructure
• Industrial control systems requiring fast memory access

Memory IC Procurement Notes

Verify component authenticity through authorized distributors due to potential counterfeit risks. Confirm RoHS compliance status as some variants may not meet current environmental standards. Check moisture sensitivity level handling requirements during assembly. Ensure supply chain stability as availability may be limited for legacy components.

Memory IC Selection Notes

Consider the 256-pin CABGA package constraints for PCB layout and thermal management. Evaluate the 166 MHz clock speed against system timing requirements. Verify compatibility with 2.5V logic levels for I/O signals. Assess power consumption profiles for both active and standby modes relative to system design goals.

Memory IC Part Context

This component belongs to the 70T3339 series of synchronous dual-port SRAMs. It is part of Renesas' portfolio of high-performance memory solutions designed for demanding applications. The series offers various configurations to support different bus widths and densities while maintaining high-speed operation capabilities.

Memory IC Replacement Considerations

Check for direct pin-to-pin replacements within the 70T33xx series. Verify electrical parameter compatibility including voltage levels and access times. Review datasheet updates for any functional changes in newer revisions.