70T3399S200BC

Memory IC Overview

The 70T3399S200BC is a synchronous Dual-Port SRAM with a storage capacity of 2Mbit, organized as 128K x 18 bits. It features a parallel interface and operates at a maximum clock frequency of 200 MHz with an access time of 3.4 ns. The device supports a supply voltage range of 2.4V to 2.6V and functions within an operating temperature range of 0°C to 70°C. It is housed in a 256-CABGA (17x17) surface-mount package.

Memory IC Feature Summary

• Provides simultaneous independent access to data via dual-port architecture for high-speed burst data flow
• Optimized for applications requiring unidirectional or bidirectional data transfer
• Supports standard power operation with low-voltage compatibility

Memory IC Applications

• High-speed networking equipment
• Telecommunications systems
• Industrial automation controllers

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to End-of-Life status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Validate pinout and electrical specifications against final design schematics before integration. Check for available replacement alternatives if long-term supply stability is required.

Memory IC Selection Notes

Select this component for designs requiring fast, concurrent read/write operations between two masters. Ensure the system logic supports the 200 MHz synchronous timing constraints. Verify that the PCB layout accommodates the 256-CABGA package dimensions and thermal dissipation needs for the specified voltage range.

Memory IC Part Context

This part belongs to the Renesas 70T3399 series of synchronous Dual-Port RAMs. It shares architectural similarities with other variants in the family but offers specific speed and organization characteristics tailored for high-throughput memory buffering tasks in embedded systems.

Memory IC Replacement Considerations

Consult official documentation for confirmed substitute part numbers. Evaluate functional equivalence regarding access times, voltage levels, and package footprint when selecting alternatives.