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70T3509MS150BPI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 36MBIT LVTTL 256CABGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for 70T3509MS150BPI
- Description：IC SRAM 36MBIT LVTTL 256CABGA
- Series：-
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Dual Port, Standard
- Memory Size：36Mbit
- Memory Organization：1M x 36
- Memory Interface：LVTTL
- Clock Frequency：150 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.4V ~ 2.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：256-BGA
- Supplier Device Package：256-CABGA (17x17)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for 70T3509MS150BPI
Memory IC Overview
The Renesas 70T3509MS150BPI is a high-speed synchronous dual-port static random-access memory (SRAM) device. It features a storage capacity of 36 Mbit, organized as 1 Megabit by 36 bits. The component supports a maximum clock frequency of 150 MHz with an access time of 4.2 ns. It operates within a voltage range of 2.4 V to 2.6 V and utilizes a parallel interface. The device is housed in a 256-pin CABGA package measuring 17x17 mm.
Memory IC Feature Summary
- Provides simultaneous independent read/write access to two separate ports using dedicated dual-port memory cells.
- Supports high-frequency operation up to 150 MHz for rapid data throughput.
- Integrates standard power management capabilities within the specified voltage range.
Memory IC Applications
- High-performance network routers and switches
- Telecommunications base station equipment
- Industrial automation control systems
Memory IC Procurement Notes
Verify the specific suffix 'BPI' against official Renesas documentation to confirm pinout and package dimensions. Ensure compatibility with system voltage levels between 2.4 V and 2.6 V. Confirm moisture sensitivity handling requirements prior to assembly. Validate that the 256-CABGA footprint matches the target PCB design constraints.
Memory IC Selection Notes
Select this component when dual-port architecture is required for concurrent processor access. The 150 MHz speed rating suits applications demanding low-latency data exchange. Consider the 36-bit word width for error correction code implementations. Evaluate the CABGA package size against available board real estate.
Memory IC Part Context
This part belongs to the IDT 70T3509M series of synchronous dual-port SRAMs. It shares architectural similarities with other members like the 70T3509MS133BPGI but offers higher clock speeds. The series is designed for embedded systems requiring reliable, fast memory access without bus contention.
Memory IC Replacement Considerations
The 70T3509MS133BPGI serves as a lower-speed alternative within the same family. Verify pin compatibility and timing parameters before substitution. No direct cross-brand equivalents are confirmed in public documentation.
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