Memory IC 70T3509MS200BPI product image

70T3509MS200BPI

  • Description:IC SRAM 36MBIT LVTTL 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:a43f65bb83b2 Category: Brand:

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70T3509MS200BPI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 36MBIT LVTTL 256CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70T3509MS200BPI

  • Description:IC SRAM 36MBIT LVTTL 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Standard
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:LVTTL
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.4V ~ 2.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-CABGA (17x17)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for 70T3509MS200BPI

70T3509MS200BPI

Memory IC Overview

The 70T3509MS200BPI is a dual-port synchronous static random-access memory (SRAM) manufactured by Renesas Electronics. It features a storage capacity of 36 Mbit organized as 1M x 36 bits. The device supports a maximum clock frequency of 200 MHz with an access time of 4.2 ns. It operates on a single 2.5V power supply, ranging from 2.4V to 2.6V. The component utilizes a parallel interface and is housed in a 256-pin CABGA package measuring 17x17 mm. It functions within a commercial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Dual-port architecture enabling independent simultaneous access to the same memory array for two distinct masters.
  • Synchronous operation synchronized to a single clock input for predictable timing and high-speed data transfer.
  • Standard low-voltage LVTTL interface compatible with standard logic levels.

Memory IC Applications

  • High-performance networking equipment requiring rapid packet buffering.
  • Telecommunications systems utilizing DSP-based signal processing.
  • Industrial automation controllers needing fast local data storage.

Memory IC Procurement Notes

Verify end-of-life status before procurement as discontinuation notices may apply. Confirm RoHS compliance requirements against specific project constraints. Ensure ESD protection protocols are followed during handling due to moisture sensitivity classification. Validate pin compatibility with existing PCB footprints prior to ordering.

Memory IC Selection Notes

Select this component when dual-port functionality is required for concurrent master access. Choose based on the 200 MHz speed grade if higher throughput than the 133 MHz variant is necessary. Ensure system design accommodates the 256-CABGA package dimensions and thermal dissipation characteristics.

Memory IC Part Context

This part belongs to the 70T3509M series of high-speed synchronous SRAMs. It shares architectural similarities with other members like the 70T3509MS133BPI but offers increased clock frequency capabilities. The series is designed for applications demanding low latency and high bandwidth memory solutions.

Memory IC Replacement Considerations

The 70T3509MS133BPI is a confirmed substitute within the same family, offering identical pinout and functionality at a lower 133 MHz clock speed. Verify that the reduced frequency meets system timing requirements before substitution.

70T3509MS200BPI70T3509MS200BPI

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