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70T3519S200BC is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 9MBIT PARALLEL 256CABGA. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 70T3519S200BC is a high-speed synchronous dual-port static random access memory (SRAM) with a total storage capacity of 9 megabits. The device features a memory organization of 256K words by 36 bits, providing independent read and write capabilities for both ports simultaneously. It supports a maximum clock frequency of 200 MHz with an access time of 3.4 nanoseconds. The component operates on a single 2.5-volt power supply within a specified range of 2.4 to 2.6 volts. It utilizes a parallel interface and is housed in a 256-lead cavity ball grid array package measuring 17 by 17 millimeters.
Verify the specific suffix designation against official manufacturer documentation to confirm pinout compatibility and electrical specifications. Confirm current production status as this series may have reached end-of-life stages. Ensure that the selected variant matches the required thermal operating range and moisture sensitivity level for the intended assembly process. Cross-reference ordering information with authorized distributors to avoid counterfeit components.
Select this component when simultaneous bidirectional data transfer between two processors or logic blocks is required without external arbitration logic. The synchronous architecture simplifies timing constraints compared to asynchronous alternatives. Evaluate the 256-lead BGA package requirements against available printed circuit board space and thermal dissipation capabilities. Consider the 2.5-volt core voltage requirement for power budget calculations and signal integrity analysis.
This device belongs to the 70T3519 family of synchronous dual-port RAMs designed for high-performance embedded applications. The family offers various speed grades and packaging options to accommodate different system latency and density requirements. These components are engineered to support complex data processing tasks where low latency and high throughput are critical for maintaining system stability and efficiency.
Publicly confirmed substitute part numbers are not available in the provided source material.
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