Memory IC 70T3539MS166BCG product image

70T3539MS166BCG

$304.41
  • Description:IC SRAM 18MBIT PAR 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:2d45462ac9d1 Category: Brand:

  
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70T3539MS166BCG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 18MBIT PAR 256CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70T3539MS166BCG

  • Description:IC SRAM 18MBIT PAR 256CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Synchronous
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.4V ~ 2.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-CABGA (17x17)
  • Access Time:3.6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for 70T3539MS166BCG

70T3539MS166BCG

Memory IC Overview

The 70T3539MS166BCG is a synchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics. It features an 18 Mbit storage capacity organized as 512K words by 36 bits. The device supports a maximum clock frequency of 166 MHz with a 3.6 ns access time. It operates on a single 2.5V power supply, ranging from 2.4V to 2.6V, with a maximum current consumption of 900 mA. The component utilizes a parallel interface and is housed in a 256-pin CABGA package measuring 17x17 mm. It functions within a commercial temperature range of 0°C to +70°C.

Memory IC Feature Summary

  • Dual-port architecture enables simultaneous independent access to the same memory location by two separate processors or systems.
  • Synchronous operation ensures data transfer is coordinated with a global clock signal for high-speed burst data flow.
  • Integrated automatic power-down feature reduces standby power consumption when chip enable signals are deactivated.

Memory IC Applications

  • High-speed network routers requiring low-latency packet buffering
  • Telecommunications base stations managing real-time signal processing data
  • Industrial automation controllers needing rapid data exchange between subsystems

Memory IC Procurement Notes

Verify the specific suffix BCG confirms the 256-CABGA package and commercial temperature grade. Confirm RoHS compliance status matches project requirements. Check for moisture sensitivity level constraints during assembly. Ensure voltage specifications align with system power rails. Validate lead times due to potential long production cycles.

Memory IC Selection Notes

Select this component when synchronous dual-port connectivity is required for 36-bit wide data paths. Compare against asynchronous alternatives if clock distribution is complex. Consider the 166 MHz speed limit for system timing budgets. Evaluate power consumption limits against available thermal dissipation. Verify package compatibility with existing PCB footprints.

Memory IC Part Context

This part belongs to the 70T3539M series of high-speed synchronous dual-port SRAMs. The series offers various speed grades and packaging options to suit different performance and form factor needs. It is designed for applications demanding concurrent read/write operations without external arbitration logic.

Memory IC Replacement Considerations

The 70T3539MS133BCG is a documented similar alternative within the same family. It shares the same organization and package but operates at a lower 133 MHz frequency. Verify electrical compatibility before substitution.

70T3539MS166BCG70T3539MS166BCG
$304.41
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