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70T3589S166BC8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 2MBIT PARALLEL 256CABGA. Review the specifications below when checking this part for your BOM.
The 70T3589S166BC8 is a high-speed synchronous dual-port static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics. It features a storage capacity of 2 megabits organized as 128K words by 18 bits. The device supports a clock frequency of 166 MHz with an access time of 3.6 nanoseconds. It operates within a supply voltage range of 3.15V to 3.45V and is housed in a 256-pin CABGA package measuring 17x17 mm.
Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance requirements as the device may not meet current environmental standards. Validate package integrity upon receipt, ensuring no damage to the 256-pin CABGA structure. Review official discontinuation notices for final purchase deadlines and last-time buy information before committing to procurement orders.
Select this component when specific 166 MHz synchronous performance and 18-bit word width are required. Ensure system power supplies maintain the 3.15V to 3.45V operating range for reliable timing. Consider the 256-pin CABGA footprint constraints during PCB layout design. Evaluate alternative devices if lead-free manufacturing or active production status is mandatory for the project lifecycle.
This part belongs to the 70V3399/70T3589 family of synchronous dual-port SRAMs. These devices are designed for applications demanding high bandwidth and deterministic access times. The family typically offers various speed grades and organizational configurations to suit different processing architectures and memory density requirements in embedded systems.
Consult official datasheets for pin-compatible alternatives within the same series. Verify electrical parameter equivalence, particularly access times and voltage tolerances. Check for package compatibility to ensure seamless integration into existing hardware designs without redesigning the motherboard or carrier board.
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