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70T3589S166BF8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 2MBIT PARALLEL 208CABGA. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 70T3589S166BF8 is a synchronous dual-port static random-access memory (SRAM) integrated circuit. It features a storage capacity of 2 Mbit organized as 64K x 36 bits. The device supports a maximum clock frequency of 166 MHz with an access time of 3.6 ns. It operates within a supply voltage range of 2.4V to 2.6V and functions at temperatures between 0°C and 70°C. The component is housed in a 208-lead CABGA package measuring 15x15 mm.
This component has reached end-of-life status, with discontinuance notifications issued in early 2024. Availability is strictly limited to existing stock or surplus channels. Verify RoHS compliance status carefully, as the product does not meet current RoHS standards. Confirm moisture sensitivity level and shelf life constraints before procurement to ensure proper handling and storage conditions are maintained.
Engineers should evaluate alternative components from the same family or newer generations due to the discontinued status of this specific part number. Consider interface compatibility and pinout similarities when selecting replacements. Verify that potential substitutes support the required 166 MHz clock speed and 36-bit data width. Assess long-term supply chain stability for new designs to avoid future obsolescence risks associated with legacy memory technologies.
The 70T3589 belongs to the 70T35xx series of synchronous dual-port SRAMs manufactured by Renesas Electronics. This series is designed for applications demanding high bandwidth and low latency. The 70T3589 variant specifically offers 2 Mbit density. It utilizes advanced CMOS technology to achieve performance levels suitable for demanding digital signal processing tasks.
Publicly confirmed substitute part numbers are not available in the provided documentation. Users must identify compatible alternatives based on electrical specifications and mechanical footprint requirements independently.
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