70T3799MS133BBGI

Memory IC Overview

The Renesas Electronics Corporation 70T3799MS133BBGI is a 9Mb synchronous dual-port SRAM organized as 128K x 72 bits. It operates at a clock frequency of 133 MHz with an access time of 4.2 ns. The device uses a parallel interface and requires a supply voltage between 2.4V and 2.6V. It is housed in a 324-PBGA (19x19) package and supports an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports simultaneous independent access to the same memory location by both ports
• Features full synchronous operation on both ports for high-speed data transfer
• Includes interrupt and collision detection flags for port-to-port communication

Memory IC Applications

• High-performance networking equipment requiring low-latency data buffering
• Telecommunications systems utilizing burst data flow architectures
• Industrial control systems needing reliable dual-port memory interfaces

Memory IC Procurement Notes

This component has been officially discontinued by the manufacturer, with end-of-life notifications issued in early 2024. Verification of current availability must rely on distributor surplus or secondary market sources rather than direct manufacturing channels. Buyers should confirm the specific revision status and moisture sensitivity level before procurement to ensure compatibility with existing assembly processes.

Memory IC Selection Notes

Engineers selecting this part should consider its specific 128K x 72 bit organization and 324-pin BGA footprint during board layout. The requirement for a narrow 2.4V to 2.6V core voltage supply necessitates precise power regulation design. Due to the discontinuation status, alternative solutions with similar synchronous dual-port capabilities and compatible pinouts should be evaluated for long-term production viability.

Memory IC Part Context

The 70T3799 series belongs to Renesas' family of high-speed synchronous dual-port RAMs designed for applications demanding unidirectional or bidirectional data flow in bursts. These devices typically integrate automatic power-down features controlled by chip enables to minimize standby power consumption while maintaining high performance during active operations.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.