Memory IC 70T633S10BFG product image

70T633S10BFG

$132.10
  • Description:IC SRAM 9MBIT PARALLEL 208CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:83d0122ba3f0 Category: Brand:

  
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70T633S10BFG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 9MBIT PARALLEL 208CABGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 70T633S10BFG

  • Description:IC SRAM 9MBIT PARALLEL 208CABGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Asynchronous
  • Memory Size:9Mbit
  • Memory Organization:512K x 18
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:10ns
  • Voltage - Supply:2.4V ~ 2.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:208-LFBGA
  • Supplier Device Package:208-CABGA (15x15)
  • Access Time:10 ns

Memory IC datasheet and documents for 70T633S10BFG

70T633S10BFG

Memory IC Overview

The Renesas Electronics Corporation 70T633S10BFG is a high-speed asynchronous dual-port static random-access memory (SRAM) device. It features a storage capacity of 9 Mbit, organized as 512K words by 18 bits. The component supports parallel interface communication with a maximum access time of 10 ns. It operates within a supply voltage range of 2.4 V to 2.6 V and functions reliably across an industrial temperature range from -40°C to +85°C. The device is housed in a 256-pin CABGA package designed for surface-mount technology applications.

Memory IC Feature Summary

  • Dual-port architecture enables simultaneous independent access to the same memory location from two separate ports.
  • Asynchronous operation allows flexible timing control without reliance on a global clock signal.
  • Industrial temperature rating ensures stable performance in demanding environmental conditions.

Memory IC Applications

  • High-performance computing systems requiring fast data buffering
  • Telecommunications equipment utilizing parallel memory interfaces
  • Industrial automation controllers needing reliable volatile storage

Memory IC Procurement Notes

Verify the specific suffix BFG against official Renesas documentation to confirm pinout compatibility and moisture sensitivity level requirements. Ensure that the 2.4V to 2.6V power supply constraints are strictly maintained during system design. Confirm RoHS compliance status through current manufacturer datasheets before finalizing procurement specifications.

Memory IC Selection Notes

Select this component when a 9 Mbit asynchronous dual-port SRAM is required with 10 ns access speed. The 256-pin CABGA package suits high-density board layouts. Verify that the 2.5V core voltage aligns with existing system power rails. Consider the industrial temperature range if deployment occurs in harsh environments.

Memory IC Part Context

This part belongs to the Renesas 70T633 series of asynchronous dual-port SRAMs. The series provides scalable memory solutions for complex digital systems. The 70T633S10 variant specifically targets applications needing rapid data throughput with low latency. The BFG suffix denotes specific packaging and material configurations defined by the manufacturer.

Memory IC Replacement Considerations

Consult official Renesas engineering change notices for verified substitutes. Cross-reference pinouts and electrical characteristics carefully. No direct public substitute part numbers are confirmed in available sources.

70T633S10BFG70T633S10BFG
$132.10
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