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70T633S12BFI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 9MBIT PARALLEL 208CABGA. Review the specifications below when checking this part for your BOM.
The 70T633S12BFI is a static random access memory component manufactured by Renesas Electronics. It features a storage capacity of 9 Mbit organized as 512K x 18 bits. The device operates with a maximum access time of 12 ns and utilizes a parallel interface. It supports a supply voltage range from 2.4 V to 2.6 V. The component is designed for surface mount installation in a 208-CABGA package. It functions as an asynchronous dual-port RAM suitable for industrial temperature ranges.
Verify the specific suffix BFI against official Renesas documentation to confirm pinout compatibility and electrical characteristics. Confirm moisture sensitivity level requirements prior to assembly. Check for RoHS compliance status as indicated in current datasheets. Ensure ordering quantities align with manufacturer packaging standards. Validate lead times directly with authorized distributors due to potential supply chain variations.
Select this component when a 512K x 18 organization is required for dual-port memory tasks. The 12 ns access speed suits moderate-to-high frequency asynchronous interfaces. Verify that the 208-CABGA package fits the target PCB layout constraints. Compare power dissipation limits against system thermal design capabilities. Ensure the 2.5V nominal supply voltage matches the host system's power rails.
This part belongs to the Renesas 70T633 series of dual-port SRAMs. The series offers various access speeds and organizational configurations. These components are engineered for reliable data storage in demanding electronic environments. They support standard logic levels for easy integration into existing digital circuits.
IDT70T633S12BFI is listed as an alias for this component. Verify functional equivalence through official cross-reference documents before substitution. Ensure package dimensions and pin assignments match exactly to avoid hardware modifications.
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