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70V05L20PFGI8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 64KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.
The 70V05L20PFGI8 is a dual-port static random-access memory integrated circuit manufactured by Renesas Electronics Corporation. It provides a storage capacity of 64 kilobits organized as 8K words by 8 bits. The device features asynchronous parallel interface with a maximum access time of 20 nanoseconds. It operates on a single 3.3-volt power supply within a voltage range of 3.0 to 3.6 volts. The component is housed in a 64-pin Thin Quad Flat Package with a lead pitch of 0.5 millimeters, specifically designated as 64-TQFP (14x14). It supports surface-mount installation and functions within an ambient temperature range of 0°C to 70°C.
Verify the specific suffix configuration against current manufacturer documentation to ensure compatibility with existing board layouts. Confirm that the 3.3V operating voltage aligns with the target system power rails. Check for RoHS compliance status updates as manufacturing processes evolve. Validate package dimensions against mechanical constraints before finalizing procurement orders.
Select this component when a system requires true dual-port memory functionality with asynchronous control signals. It is suitable for designs needing independent host access to shared memory resources without complex external logic. Consider the 20ns access speed and 64-pin footprint for space-constrained industrial or commercial applications requiring reliable volatile data storage.
This part belongs to the 70V05L series of dual-port SRAMs from Renesas Electronics. The series is designed for high-performance memory applications where independent port access is critical. The L-series designation typically indicates specific voltage and speed characteristics optimized for low-power digital systems.
The 70V05L20PFGI is listed as a similar replacement option. Verify pinout compatibility and electrical specifications before substitution. Ensure the alternative package variant meets the same thermal and mechanical requirements.
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