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712-93-222-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 22POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 712-93-222-41-001000 is a single in-line package (SIP) socket featuring 32 positions arranged in a 1x32 configuration. It utilizes through-hole termination with solder tail contacts for secure PCB mounting. The connector employs gold-plated copper alloy contacts to ensure reliable signal transmission and corrosion resistance. Designed for standard DIP applications, it supports a mating pitch of 0.100 inches (2.54mm). The unit operates within a temperature range of -55°C to +125°C and carries an UL recognized component rating.
Verify the specific suffix codes against official Mill-Max documentation to confirm plating thickness and material specifications. Ensure compatibility with target IC footprint dimensions before procurement. Cross-reference the series designation with current manufacturer catalogs to validate availability status and lead times. Confirm that the solder tail length meets PCB board thickness requirements for proper insertion.
Select this component when a high-density single-row interface is required for DIP packages. Evaluate the thermal stability requirements against the specified operating temperature range. Consider the mechanical robustness of the solder tail termination for vibration-prone environments. Compare contact count and row configuration against alternative multi-row sockets to optimize board space utilization.
This part belongs to the Mill-Max 712 series, which specializes in standard solder tail carrier sockets. The series is engineered for general-purpose interconnect applications requiring durable through-hole mounting. It complements other SIP and DIP socket variants within the manufacturer's portfolio by offering standardized pin layouts.
Consult official Mill-Max substitution guides for direct equivalents. Verify dimensional tolerances and contact geometry matches before swapping. Ensure electrical ratings align with system requirements. Generic cross-references may lack precise plating or material consistency.
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