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712-93-250-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 50POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 712-93-250-41-001000 is a DIP IC socket featuring 50 positions arranged in a dual-in-line configuration. It utilizes a standard solder tail termination method for through-hole mounting on printed circuit boards. The connector supports a 0.100-inch (2.54mm) contact spacing and operates within a temperature range of -55°C to +125°C. Designed as an open-frame carrier, it facilitates reliable electrical connections for integrated circuits requiring high pin counts.
Verify the specific suffix '001000' against the manufacturer's current datasheet to confirm exact plating thickness and material specifications. Ensure compatibility with standard 0.100-inch grid layouts. Confirm RoHS compliance status directly with the supplier prior to procurement, as environmental certifications may vary by production batch.
Select this component when a 50-position DIP socket is required for through-hole applications. The standard solder tail design is suitable for automated or manual wave soldering processes. Consider the operating temperature range and contact material requirements to ensure long-term reliability in the target electronic environment.
This part belongs to the Mill-Max 712 series of IC sockets, which are characterized by their standard solder tail construction. These components are widely used in electronics manufacturing for connecting DIP packages to PCBs. The 50-position variant serves applications needing higher density interconnects compared to standard 40-pin configurations.
Cross-reference with other 50-position DIP sockets from Mill-Max or compatible manufacturers. Verify that substitute parts match the 0.100-inch pitch, solder tail termination style, and physical dimensions to ensure mechanical fit and electrical continuity.
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