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714-41-214-31-012000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 14POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 714-41-214-31-012000 is a standard receptacle carrier within the 0714 series, designed for IC and component socket applications. It features a single-row configuration with 21 positions and a 2.54mm (0.100 inch) pitch. The unit utilizes solder mount termination for secure PCB attachment. Contact finishes include gold over nickel plating to ensure reliable electrical performance in standard interconnection environments.
Verify the specific contact finish and termination type against the official datasheet before procurement. Confirm that the solder mount style aligns with your assembly process requirements. Ensure the single-row receptacle format matches your circuit board layout constraints. Cross-reference the part number with manufacturer documentation to confirm current production status.
Select this component when a standard single-row IC socket carrier is required. The 2.54mm pitch ensures compatibility with common DIP packages. Verify that the solder mount termination suits your manufacturing capabilities. Consider the physical dimensions and row count to ensure adequate space on the target printed circuit board.
This part belongs to the Mill-Max 0714 series of standard receptacle carriers. These components are engineered for general-purpose electronic interconnections. The series offers various configurations to support different pin counts and mounting styles. This specific model provides a standardized solution for connecting integrated circuits to circuit boards.
Consult official Mill-Max substitution guides for verified alternative part numbers. Ensure any replacement maintains the same 2.54mm pitch and single-row configuration. Verify that the termination method and contact materials are compatible with your existing assembly processes.
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