714-41-214-31-018000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 714-41-214-31-018000 is a single-row IC socket carrier featuring 14 contacts with a 2.54 mm pitch. It operates at a maximum voltage of 150VDC or 100VAC and supports a current rating of 3A. The component utilizes gold-plated beryllium copper contacts for reliable signal transmission.

Headers, Receptacles, Female Sockets Feature Summary

• Ultra-low profile receptacle design sits 0.46 mm above the board surface
• Hi-Rel three-finger BeCu clip mechanism ensures secure contact retention
• Gold over nickel plating provides corrosion resistance and conductivity

Headers, Receptacles, Female Sockets Applications

• Single In-line Package (SIP) integration
• Precision-machined interconnect systems
• High-reliability electronic assemblies

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific pin count configuration against the model number to ensure compatibility with target PCB layouts. Confirm RoHS compliance status and check for any manufacturer-specific ordering suffixes that may alter physical dimensions or plating specifications before finalizing procurement orders.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when ultra-low profile height constraints are critical for the assembly. Ensure the mating device aligns with the 2.54 mm pitch standard. Evaluate the 3A current rating against system requirements to guarantee adequate thermal and electrical performance under load conditions.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max Series 714, which specializes in ultra-low profile single and double row carriers. These components are engineered for applications requiring minimal vertical clearance while maintaining high reliability through precision-machined interconnect technology.

Headers, Receptacles, Female Sockets Replacement Considerations

Cross-reference compatible single-row SIP sockets with identical 2.54 mm pitch and 14-pin configurations. Verify mechanical height tolerances and contact material specifications to ensure functional equivalence without redesigning the host circuit board.