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714-41-242-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 42POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 714-41-242-41-001000 is a rectangular connector receptacle featuring 24 positions arranged in a single row. It utilizes a 0.100 inch (2.54 mm) pin spacing and employs a push-pull fastening mechanism for secure board-to-board stacking connections. The contacts are gold-plated beryllium copper with a 10.0 µin thickness, while the mating interface features tin-lead plating at 200.0 µin. Designed for through-hole termination, it operates within a temperature range of -55°C to 125°C and carries a 3 A current rating.
Verify that the specific ordering suffix matches the required contact plating and termination style. Confirm that the push-pull fastening mechanism aligns with the mechanical constraints of the target assembly. Ensure the single-row configuration fits the available PCB footprint without interference from adjacent components or mounting hardware.
Select this component when a single-row, 24-position connection is required with high-cycle durability. The push-pull feature distinguishes it from standard press-fit alternatives, offering easier manual handling. Verify that the 0.100 inch pitch matches the mating header grid and that the operating temperature range meets environmental requirements.
This part belongs to the Mill-Max 714 series of rectangular connectors. These components are engineered for high-reliability applications requiring robust mechanical retention. The series offers various position counts and row configurations to support diverse electronic packaging needs across industrial and commercial sectors.
No public confirmed substitute part numbers are available in the provided documentation. Cross-reference with other Mill-Max 714 series variants if different position counts or row arrangements are acceptable for the application.
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